Laser Drilling and Micro-Machining System

Our new laser drilling / micromachining system from Dac Tools is available for drilling/micromachining holes in gasket material and preparing samples and sample environments for diamond anvil cells. The system is based on a pulsed laser with ~400ps pulse duration, maximum pulse energy of ~80 microjoule up to 1000 Hz. Short laser pulse duration allows ablating materials without thermal melting, thus leaving a clear edge after drilling. The laser drilling / micromachining system allows drilling nonconductive materials such as amorphous boron and silicon carbide gaskets, diamond, oxides and many other materials including organic materials (e.g. kapton. The machine can also be used for sample cutting and for making engineered samples.